Part Number Hot Search : 
FR204 AN727 KTX301U 100BG D4001 X262AMR 100MR PEF20470
Product Description
Full Text Search
 

To Download PAH8011ES-IN Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
  1 pah8011es product datasheet low power heart rate monitor optical chip pixart imaging inc. pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without per mission. version 1. 1 | 20 oct 2017 | 31008 a en pah 8011es : low power heart rate monitor optical chip general description the pah 8011es is a low power and high - performa nce cmos - process optical chip with integrated dsp, targeted as a heart rate detection (hrd) chip . it is based on optical sensing techno logy that captures higher resolution image than the traditional photodiode. the pah8011es could support three external discrete leds, which are two green and one infrared as illumination light source . the images captured are then processed through the inte grated dsp to attain processed ppg (photoplethysmogram) data for use in deducing heart rate. key features ? support hrd , hrv (heart rate variability), exercise function s ? 1596 bytes sram buffer ? integrated ultra - low power mode, while in power - down mode ? hardw are power - down ? invisible light for touch detection function ? optical coating for anti - ambient light interference ? three led - driver s support ? communication interface : i 2 c interface up to 1 mbit/s applications ? heart rate monitor accessories ? wearables : smartwat ch , wrist band key parameter s parameter value operating temperature, tj - 35 to +8 0 c system clock 4 m hz supply voltage vddm: 3. 1 C 3.6 v * vddled: 3.3 C 4.5 v * vddio: 1. 62 C 3.6 v vdda/vddd: 1.7 C 1. 9 v analog: 1.8 v digital: 1.8 v power consumpti on @ 3.3v note: including led current, without i/o toggling active: w ith two led s: 340 a w ith ir touch detection : 15 a power - down: 1 a heart rate measurement range 30 - 2 4 0 bpm package size 4.0 x 4.0 x 1.0 mm * refer to section 8.16 supply volta ge registers ordering information part number package type pah 8011es - in 16 - pin lga for any additional inquiries, please contact us at http://www.pixart.com/contact.asp *disclaimer: the pah8011 es - i n is not designed for usage in medical device. in addition, the data and information of heart rate measurement provided by this chip may not be completely accurate and may exceed heart rate tolerance as per the specification stated in the document due to d ifferent factors, such as interference with signal from external sources, incorrect wearing position and changes in weather conditions or user's body condition. pixart imaging inc. disclaims all liability arising from such inaccuracy and assumes no respon sibility for the consequences of use of such data and information.
2 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. contents pah8011es: low power heart rate monitor optical chip ................................ ................................ ................................ ........ 1 general description ................................ ................................ ................................ ................................ ............................ 1 key features ................................ ................................ ................................ ................................ ................................ ....... 1 applications ................................ ................................ ................................ ................................ ................................ ........ 1 key parameters ................................ ................................ ................................ ................................ ................................ ... 1 ordering information ................................ ................................ ................................ ................................ .......................... 1 list of figures ................................ ................................ ................................ ................................ ................................ ........... 4 list of tables ................................ ................................ ................................ ................................ ................................ ............ 5 introduction ................................ ................................ ................................ ................................ ................................ . 6 1.1 overview ................................ ................................ ................................ ................................ ................................ . 6 1.2 terminology ................................ ................................ ................................ ................................ ............................ 6 1.3 signal description ................................ ................................ ................................ ................................ .................... 7 1.4 chip array ................................ ................................ ................................ ................................ ................................ 7 1.5 adc normalized mode ................................ ................................ ................................ ................................ ............ 7 1.6 power saving mechanism ................................ ................................ ................................ ................................ ........ 7 operating specifications ................................ ................................ ................................ ................................ .............. 8 2.1 absolute maximum ratings ................................ ................................ ................................ ................................ ..... 8 2.2 recommended operating conditions ................................ ................................ ................................ ..................... 8 2.3 thermal specifi cations ................................ ................................ ................................ ................................ ............ 9 2.4 dc characteristics ................................ ................................ ................................ ................................ .................... 9 2.5 ac characteristics ................................ ................................ ................................ ................................ .................. 10 mechanical specifications ................................ ................................ ................................ ................................ .......... 11 3.1 mechanical dimension ................................ ................................ ................................ ................................ .......... 11 3.2 package marking ................................ ................................ ................................ ................................ ................... 12 system design ................................ ................................ ................................ ................................ ............................ 13 4.1 system overview ................................ ................................ ................................ ................................ ................... 13 4.2 reference schematic ................................ ................................ ................................ ................................ ............. 16 4.3 design guidelines ................................ ................................ ................................ ................................ .................. 17 4.4 recommended guidelines for pcb assembly ................................ ................................ ................................ ........ 19 4.5 package information ................................ ................................ ................................ ................................ ............. 20 power states & sequence ................................ ................................ ................................ ................................ .......... 21 5.1 power states ................................ ................................ ................................ ................................ .......................... 21 5.2 power - up and power - off sequence ................................ ................................ ................................ ....................... 21 i 2 c serial interface communication ................................ ................................ ................................ ............................ 21 6.1 signal description ................................ ................................ ................................ ................................ .................. 21 6.2 start and stop of synchronous operation ................................ ................................ ................................ ............. 21
3 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 6.3 packet formats ................................ ................................ ................................ ................................ ...................... 21 6.4 driven packets ................................ ................................ ................................ ................................ ....................... 21 6.5 i 2 c timing ................................ ................................ ................................ ................................ .............................. 21 digital soc function control ................................ ................................ ................................ ................................ ...... 21 7.1 auto exposure co ntrol (aec) ................................ ................................ ................................ ................................ . 21 7.2 auto frame period control (afpc) ................................ ................................ ................................ ........................ 21 7.3 heart rate detection ................................ ................................ ................................ ................................ ............. 21 7.4 ir touch detection ................................ ................................ ................................ ................................ ................ 21 7.5 channel report frequency ................................ ................................ ................................ ................................ .... 21 registers ................................ ................................ ................................ ................................ ................................ .... 21 8.1 registers list ................................ ................................ ................................ ................................ .......................... 21 8.2 chip array controls ................................ ................................ ................................ ................................ ............... 25 8.3 image chip core digital controls ................................ ................................ ................................ ........................... 25 8.4 reset ................................ ................................ ................................ ................................ ................................ ...... 25 8.5 power saving mode ................................ ................................ ................................ ................................ ............... 25 8.6 channel frame period and auto c ontrol frame period function ................................ ................................ ......... 25 8.7 channel report frequency ................................ ................................ ................................ ................................ .... 25 8.8 led controls ................................ ................................ ................................ ................................ .......................... 25 8.9 adc normalized mode ................................ ................................ ................................ ................................ .......... 25 8.10 touch detection controls ................................ ................................ ................................ ................................ ...... 25 8.11 timing generator controls ................................ ................................ ................................ ................................ .... 25 8.12 fifo buffer registers ................................ ................................ ................................ ................................ ............. 25 8.13 interrupt controls ................................ ................................ ................................ ................................ .................. 25 8.14 time stamp contr ols ................................ ................................ ................................ ................................ ............. 25 8.15 read information ................................ ................................ ................................ ................................ ................... 25 8.16 supply voltage registers ................................ ................................ ................................ ................................ ....... 25 document revision history ................................ ................................ ................................ ................................ .................... 25
4 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. list of figures figure 1. functional block diagram ................................ ................................ ................................ ................................ ......... 6 figure 2. pin configuration ................................ ................................ ................................ ................................ ...................... 7 figure 3. package outline diagram ................................ ................................ ................................ ................................ ........ 11 figure 4. package m arking ................................ ................................ ................................ ................................ ..................... 12 figure 5. system design for app level ................................ ................................ ................................ ................................ ... 13 figure 6. system design for firmware level ................................ ................................ ................................ .......................... 14 figure 7 . reference application circuit ................................ ................................ ................................ ................................ .. 16 figure 8. recommend layout pcb ................................ ................................ ................................ ................................ ......... 17 figure 9. pcb layout guide ................................ ................................ ................................ ................................ ................... 18 figure 10. ir reflow solder ing profile ................................ ................................ ................................ ................................ .... 19 figure 11. carrier drawing ................................ ................................ ................................ ................................ ..................... 20 figure 12. unit orientation ................................ ................................ ................................ ................................ .................... 21
5 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. list of tables table 1. signal pins description ................................ ................................ ................................ ................................ ............... 7 table 2. absolute maximum ratings ................................ ................................ ................................ ................................ ........ 8 table 3. recommende d operating conditions ................................ ................................ ................................ ........................ 8 table 4. thermal specifications ................................ ................................ ................................ ................................ ............... 9 table 5. dc electrical specifications ................................ ................................ ................................ ................................ ........ 9 table 6. ac electrical specifications ................................ ................................ ................................ ................................ ....... 10 table 7. heart rate detection specifications ................................ ................................ ................................ ......................... 15 table 8 . register bank0 ................................ ................................ ................................ ................................ .......................... 22 table 9 . register bank1 ................................ ................................ ................................ ................................ .......................... 23 table 10 . register bank2 ................................ ................................ ................................ ................................ ........................ 24 table 11 . register bank4 ................................ ................................ ................................ ................................ ........................ 24
6 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. introduction 1.1 overview the pah 8011es is a discrete optical - based heart rate detection (hrd) chip that optimizes for low power and high - performance operation . it has three leds driver to support with 2 green leds a nd 1 infra r ed led externally . it comes with i 2 c communication interface , which support s up to 1 mbit/s . sram buffer of 1596 bytes is supported for the power saving at the host. the figure 1 show s the architecture block diagram of the device. refer to the subsequent chapters for detailed information on the functionality of the different interface blocks. note: throughout this document pah 8011es low power optical heart rate monitor chip is referred to as the pah8011e s . figure 1 . functional block diagram 1.2 terminology term description gnd ground bidir bi - directional ppg photoplethysmogram touch touch detection for wear on or wear off array timing g enerator pga + adc led d river signal p rocess sram fifo buffer led channel clock g enerator lo speed rc 32 khz hi speed rc 4 mhz power regulator output vdday : 2 . 8 v input vddm : 3 . 1 - 3 . 6 v vdda / vddd : 1 . 7 - 1 . 9 v vddio : 1 . 62 - 3 . 6 v int 1 i 2 c ch _ a pah 80 11 es led 1 led 2 powerdn led 0 vdda y vdda / vddd vddio i 2 c _ scl i / o i nterface s i 2 c _ sda vddm int 2 vssa vssd vssled p o w e r g n d serial interface led driver int 1 powerdn int 2 ch _ b ch _ c ch _ t
7 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 1.3 signal description figure 2 . pin configuration table 1 . signal pins description pin no. signal name type description functional group: power supplies 1 vdda input analog power supply (1.7 - 1.9v) . must connect 0. 1f capacitor to gn d 2 vddm input analog main power supply (3. 1 - 3.6v) for internal power regulator 6 vssled gnd led ground 7 vdd ay output internal regulator output . must connect 0. 1 f capacitor to gnd 8 vssa g nd a nalog ground 14 vddio input i/o power supp ly ( 1.62 - 3. 6 v) 15 vssd gnd digital ground 16 vddd input digital power supply (1.7 - 1. 9 v) . must connect 0. 1f capacitor to gnd functional group: interface 9 i2c_scl input i 2 c: c lock 10 i2c_sda bidir i 2 c: data input - output functional group: functional i/o 11 powerdn input hardware control to enter power down m ode . connect to gnd when not used level high: enter power down mode level low: leave power down m ode 12 int 2 output touch interrupt. default is edge sensitive interrupt, can be changed to level sensitive interrupt (high active) in int_type register 13 int 1 output data ready interrupt. default is edge sensitive interrupt, can be changed to level sensitive interrupt (high active) in int_type register functional group: led driver control 3 led2 output led 2 driver connection. must connect to green led cathode 4 led1 output led1 driver connection. must connect to green led cathode 5 led0 output led0 driver connection. must connect to ir led cathode
8 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. operating specifications 2.1 absolute maximum ratings table 2 . absolute maximum ratings parameters symbol min. max. unit notes analog voltage v ddm _max - 0.4 v dd m + 0.3 v i/o voltage v ddio_max - 0.4 v ddio + 0.3 v i/o pin input high voltage v ddio_ in - 0. 4 v ddio + 0.3 v all i/o pins relative humidity rh 0 50 % non - condensing, non - biased esd esd hbm - 2 kv class 2 on all pins, as per human body model . jesd22 - a114e with 15 sec zap interval. notes: 1. at room temperature. 2. maximum ratings are those values beyond which damage to the device may occur. 3. expos ure to these conditions or conditions beyond those indicated may adversely affect device reliability. 4. functional operation under absolute maximum - r ated conditions is not implied and should be restricted to the recommended operating conditions. 2.2 recommende d operating conditions table 3 . recommended operating conditions description symbol min. typ. max. unit notes a mbient temperature t a - 20 25 60 c operating junction temperature t j - 35 - 80 c power supply voltage v ddm 3. 1 3.3 3.6 v power regulator input supply. includes ripples led power supply voltage v ddled 3.3 - 4.5 v led power supply . includes ripples analog supply voltage v dda 1.7 1.8 1. 9 v analog power supply . includes ripples digital supply voltage v ddd 1.7 1.8 1. 9 v digital power supply . includes ripples i/o supply voltage v ddio 1.62 1.8 3.6 v includes ripples power regulator output voltage v dday 2.52 2.8 3.08 v internal regulator output . includes ripples supply noise v npp - - 100 mv p - p peak to peak within 10k C 80 mhz i 2 c clock frequency scl _i 2 c - 400 1 1 000 2 khz 1. max value for fast mode 2. max value for fast mode plus note: pixart does not guarantee the performance if the operating temperature is beyond the specified limit .
9 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 2.3 thermal specifications table 4 . thermal specifications parameters symbol min. typ. max. unit notes storage temperature t s - 40 - 125 c lead - free solder temperature t p - - 245 c refer to package handling information document 2.4 dc characteristics table 5 . dc electrical specifications parameters symbol min. typ. max. unit condition s peak power supply current i ddm_max - - 10 ma for v ddm i ddled_max - - 150 ma for v ddled i ddd_max - - 20 ma for v ddd i dda _max - - 10 ma for v dda peak i/o supply current i ddio_max - - 30 ma for v ddio output supply current i dday _max - - 20 ma for v dday power consumption supply current @ power down i ddpd - 1 - ua for chip only w akeup by read register with two green leds supply current @ hrd ppg mode i ddhr d - 100 - ua f or chip only, n o t including led current, without i 2 c interface i/o toggle led current i ddled - 24 0 - ua 20 report/sec, led dac = 50 ma , on yellow skin color (et= 3 0us) with ir touch detection supply current @ touch detection mode i ddtouch 9 ua f or chip only, n o t including led current, without i 2 c interface i/o toggle led current at touch i ddled - 6 - ua 8 report/sec, led dac = 50 ma , on yellow skin color (et=10us) i/o input high voltage v ih 0.7* v ddio - - v input low voltage v il - - 0.3 * v ddio v output high voltage v oh v ddio C 0.4 - v ddio + 0.4 v @i oh = 2 ma output low voltage v ol - 0.4 - 0. 4 v @i ol = 2 ma led sink current i led 40 50 60 ma @ led dac = 5 0ma led cathode voltage v led - 0.4 3.6 v notes: 1. electrical characteristics are defined under recommended operating conditions . 2. all the parameters are tested under operating conditions: v ddm = 3.3 v, v ddio = 1.8 and 3.3 v, t a = 25c
10 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 2.5 ac characteristics table 6 . ac electrical specifications parameters symbol min. typ. max. unit condition s power up from v dd t pu - 10 - ms from v dd to valid interface communication address and data delay time t delay 2.75 - us refer to serial interface section chip pulse interrupt width t int 2 - 32 us default 32 us, can be changed in int_pulse_width register hw powerdn ti me t powerdn 300 500 - us powerdn keep high period note s : 1. electrical characteristics are defined under recommended operating conditions 2. all the parameters are tested under operating conditions: t a = 25c , v dd m = 3 . 3 v, v ddio = 3.3v for 3.3v io applicatio n and v ddio = 1.8 v for 1.8v io application.
11 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. mechanical specifications 3.1 mechanical dimension figure 3 . package outline diagram
12 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 3.2 package marking refer to figure 4 . package marking for the code marking loc ation on the device package. figure 4 . package marking
13 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. system design 4.1 system overview this section describe s on how the chip being used to make up a complete system including the explanation on the 3 rd party c omponents and how they work with the chip . the pah 8011 es is based on cmos optical technology and designed to meet the requirements for the implementation in heart r ate m onitor a ccessories and wearables like smart watch or wrist band device. figure 5 illustrates a system design for app l evel diagram. the p rocessor is access ing ppg data from the chip , then pass it to app l evel . app l evel appl ies pixart provided algorithm library to determine the heart rate data and wa veform. figure 6 . system design for firmware level illustrates a system design for firmware level diagram. the p rocessor will also access ppg data from the chip , then p erform heart rate calculation with pixart algorithm library and send result to display or end device . pah8011es can be configur ed to generate different frame ra te setting . figure 5 . system design for app le vel array
14 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. figure 6 . system design for firmware level 4.2 heart rate detect ion h eart rate detection is an optical measurement technique that uses a light source and a detector to detect cardiovascular pulse wave that propagates through the body. the detected signal (pulse wave) called photoplethysmography and it is known as ppg/p tg. the ppg signal reflects the blood movement in the vessel, which goes from the heart to the fingertips through the blood vessels in a wave - like motion. therefore, we can use this ppg signal to calculate heart rate. this optical based technology could o ffer significant benefits in healthcare application as it is noninvasive, yet accurate and simple to use . 4.2.1 application s ? heart r ate detection in general healthcare (perfusion index : typ.1% ) ? ppg waveform array
15 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 4.2.2 heart rate detection performance table 7 . heart rate detection specifications p arameters value unit conditions heart rate measurement range 30 C 2 4 0 bpm heart rate tolerance of average root mean square ( a rms) 3 bpm @ room temperature for steady state: 0 km/hr. 5 bpm @ room temperature for motion state: 0 C 9 km/hr on the treadmill. response time 8 C 10 sec ond @ h eart r ate = 72/bpm notes : ? p ah 8011es can provide heart rate measurement. however, it is not for medical device usage. ? for usage of heart rate detection chip o n the wearable device that to be put on the wrist, finger or palm, ? the chip must be placed securely and in - contact with the skin surface as well as keeping it stable without any motion during measurement in acquiring accurate heart rate measurement. ? do n ot wear the device on the wrist bone . it should be wear on the higher position of, especially for those with a smaller wrist. ? chip s performance is optimized with good blood flow. it is recommended to have light exercise for a few minutes to increase your blood flow before turning on the heart rate monitor. ? on cold weather condition or user is having poor blood circulation (e.g.: cold hands, fingers and feet), the chip performance (heart rate accuracy) could be effected as the blood flow is slower in the m easuring spot position. it is recommended to activate the heart rate monitor in indoor use. ? if the chip is having problem to read heart rate, may t ry to swap it on the other side of hand wrist to repeat the measurement. ? for continuous heart rate measuremen t, do m inimize hand movement and extreme bending of the wrist.
16 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 4.3 r eference schematic figure 7 . reference application circuit PAH8011ES-IN int1 13 led0 5 vssled 6 int2 12 powerdn 11 vddio 14 led1 4 vddm 2 led2 3 vdda 1 vdday 7 vssa 8 i2c_scl 9 i2c_sda 10 vddd 16 vssd 15 ledgnd c1 0.1uf c2 10uf r1 0 vdd_led d1 ir led0(0603) led0 layout note: 1. c7, c8, c9, c10 capacitor close to package 2. agnd, dgnd, ledgnd separate and connect to pcb main ground host interface: 3.1 - 3.6v (vddm) 3.3 - 4.5v (vddled) 1.7 - 1.9v (vdd18v) vddio (1.8 - 3.3v) gnd i2c_scl i2c_sda int1 int2 powerdn c7 0.1uf agnd c3 0.1uf c4 10uf c9 0.1uf dgnd r3 0 r2 0 c8 0.1uf PAH8011ES-IN sensor only agnd vdda c5 0.1uf c6 10uf vssled led2 vddm vddd vdday vssa vddio led0 led1 int1 int2 powerdn i2c_scl i2c_sda vddm c10 0.1uf vddled vdd18v agnd agnd dgnd vssd led1 d2 green led1(0603) d3 green led2(0603) led2
17 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 4.4 design guideline s 4.4.1 schematic design 1. vddm & vddio & vddled: 3.3v, vdd18v: 1.8v ( for 3.3v s ystem) 2. vddm & vddled : 3.3v~3.6v, vddio : 1.8v, vdd18v : 1.8v ( for 1.8v system) 3. vddm & vddled : 3.3v~3.6v, vdd18v : 1.8v , vddio : 2.8v ( for 2 .8v system) 4. it is recommended t o separate the power system of vddm/vddled and wireless system to avoid power interferenc e. 5. the maximum load current of ldo ( supplying power to vddm/vdd18v/vddled/vddio ) need to be larger than 250ma. for m aximum current of each power rail , refer to iddm_max, iddled_max , iddd_max, idda_max, iddio_max and idday_max parame ters in table 5 . dc electrical specifications 6. i2c_sda and i2c_scl must pull high to vddio with resistor. 7. vddm, vddd, vdda, vdday must have 0.1f capacitor co nnect ing to gnd and place close ly to 8011. 8. the agnd , dgnd and ledgnd must be separate d and connected to pcb main gnd . 9. int 1 pin is recommended to be connect ed to mcu hw int as data ready int for power saving . 10. int2 pin is recommended to be connected to mcu hw int for touch function. 11. ensure that the v ddm, vddled, vdd18vs power noise should be under 100mv . (with 0.1 f and 10 f capacitor) 12. at power on, v ddio must be powered on equal to or first than vdd18v . note: when vddio must be powered on first before vddm , host should prevent using the i2c interface (connected with chip ) to switch the ldo providing vddm voltage. 13. at power off for 1.8v io system , vddm must be powered off first than vdd18v/vddio. 14. at power off for 2.8v/3.3v io system , vddio and vddm must be po wered off first than vdd18v. 15. when pah 8011es is not in use d , put the chip into power down mode . 4.4.2 recommend layout pcb 4.4.2.1 pad dimension on pcb /fpc 1. pad size design: ? if use solder mask defined (smd), pad size is referred as sold er mask opening size. ? if use non - solder mask defined (non - smd), pad size is referred as copper metal size. 2. re commended dimension of pad is shown in figure 8 . the actual pad size design will need to consider components aside. (all dimensions are in mm) figure 8 . recommend layout pcb
18 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 4.4.2.2 recommendation of s tiffener if use fpc ( flex ) board, need add stiffener for fpc (fle x) back - side (at sensor package area) to enhance the flex strength. 1. r ecommended stiffener type: fr4 or stainless steel. 2. recommended stiffener thickness: minimum 0.4mm for fr4 type, minimum 0.15mm for stainless st eel. 4.4.2.3 recommended use 0.1~0.12mm thickness stencil for smt pr o cess. 1. the stencil thickness selection will need to cons i der passive component size aside package. 2. in case of the package is surface mounted on fpcb (flexible printed circuit boards) , the overall thickness of cover layer & adhesive layer is recommenced to be controlled l e ss than 40um. 4.4.2.4 pcb layout guidelines the following guidelines can be refer to figure 9 . pcb layout guide . 1. trace width of vddm , vddio , vdd led , vdda , vddd , vdday , led0, led1, led2 traces must be at least 8 mil s . 2. capacitor 0.1 f must be placed close to the chip package. 3. the gnd plane of gnd of vssa, vssd and vssled must be layout separately and connected to the pcbs main gnd. 4. if use fpc (flex) board, recommend vssled pin separa tely to output pin, because of high led current operation. figure 9 . pcb layout guide
19 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 4.5 recommend ed guideline s for pcb assembly recommended vend o r and type for pb - free solder paste 1. almit lfm - 48w tm - hp 2. senju m705 - grn360 - k i r reflow soldering profile can be refer to figure 10 . ir reflow soldering profile : temperature profile is the most important control in reflow soldering. it must be fine - tuned to establi sh a robust process. figure 10 . ir reflow soldering profile note: (1) average ramp - up rate (30 c to preheat zone): 1.5~2.5 c /sec (2) preheat zone: (2.1) temperature ramp from 170~200 c (2.2) exposure time: 90 +/ - 30 sec (3) m elting zone: (3.1) melting area temperature > 220 c for at least 30~50sec (3.2) peak temperature: 245 c ms level : ms level 3
20 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 4.6 package information 4.6.1 carrier drawing figure 11 . carrier drawing
21 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 4.6.2 un it orientation figure 12 . unit orientation the maximum capacity of one packing box for pah 8011es \ i n : one inner packing box = 2500 units note: the tape and reel packing with vacuum pack is 1year storage available @ 25 c , 50%rh
22 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. reg isters list table 8 . register bank0 note: switch to register ba nk0 by writing 0x00 to reg - 0x7f address register name access default address register name access default 0x00 product_id_lb ro 0x11 0x41 ae_chb_innerhitarge t_lb r/w 0x00 0x01 product_id_hb ro 0x80 0x42 ae_chb_innerhitarget_hb r/w 0x09 0x02 version_id ro 0xb 1 0x43 ae_chb_innerlotarget_lb r/w 0x00 0x13 ae_ ch a_enh r/w 0x03 0x44 ae_chb_innerlotarget_hb r/w 0x07 0x14 ae_ch a_item r/w 0x1 b 0x49 ae_chb_led_dac_ma x r/w 0x3f 0x16 ae_ch a_et_max_lb r/w 0x a0 0x4a ae_chb_led_dac_min r/w 0x01 0x17 ae_c h a_et_max_hb r/w 0x00 0 x 51 ae_chc_enh r/w 0x03 0x19 ae_cha_et_min _lb r/w 0x20 0x52 ae_chc_item r/w 0x1 b 0x1a ae_cha_et_min _hb r/w 0x00 0x54 ae_chc_et_max_lb r/w 0xa0 0 x1d ae_ch a_et _step r/w 0x08 0x55 ae_chc_et_max_hb r/w 0x00 0x1e ae_cha _outer hib ound_lb r/w 0x00 0x57 ae_chc_et_min_lb r/w 0x20 0x1f ae_cha _outer hib ound_hb r/w 0x 0a 0x58 ae_chc_et_min_hb r/w 0x00 0x20 ae_cha _ outerlobound _lb r/w 0x00 0x5b ae_chc_et_step r /w 0x08 0x21 ae_cha_outerlobound _hb r/w 0x06 0x5c ae_chc_outerhibound_lb r/w 0x00 0x22 ae_cha _inner hitarget _lb r/w 0x00 0x5d ae_chc_outerhibound_hb r/w 0x 0a 0x23 ae_cha _inner hitarget _hb r/w 0x09 0x5e ae_chc_outerlobound_lb r/w 0x00 0x24 ae_cha _inner lot arget _lb r/w 0x00 0x5f ae_chc_outerlobound_hb r/w 0x06 0x25 ae_cha _inner lotarget _hb r/w 0x07 0x60 ae_chc_innerhitarget_lb r/w 0x00 0x2 a ae_cha_led_dac_max r/w 0x 3f 0x61 ae_chc_innerhitarget_hb r/w 0x09 0x2b ae_cha_led _dac_min r/w 0x01 0x62 ae_chc_innerl otarget_lb r/w 0x00 0x32 ae_chb _enh r/w 0x03 0x63 ae_chc_innerlotarget_hb r/w 0x07 0x33 ae_chb _item r/w 0x1 b 0x68 ae_chc_led_dac_max r/w 0x3f 0x35 ae_chb _et_max_lb r/w 0x a0 0x69 ae_chc_led_dac_min r/w 0x01 0x36 ae_chb _et_max_hb r/w 0x00 0x70 c h a_led _as sign r/w 0x01 0x38 ae_chb_et_min _lb r/w 0x20 0x71 ch b _led _assign r/w 0x02 0x39 ae_chb_et_min _hb r/w 0x00 0x72 chc_led _assign r/w 0x04 0x3c ae_chb _et _step r/w 0x08 0x73 cha_ pixel_assign r/w 0x0f 0x3d ae_chb _outer hib ound_lb r/w 0x00 0x74 ch b _ pixel_assign r/w 0x0f 0x3e ae_chb _outer hib ound_hb r/w 0x 0a 0x75 chc_ pixel_assign r/w 0x0f 0x3f ae_chb _ outerlobound _lb r/w 0x00 0x40 ae_chb_outerlobound _hb r/w 0x06
23 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. table 9 . register bank1 note: switch to register ba nk1 by wri ting 0x01 to reg - 0x7f address register name access default address register name access default 0x00 cht _touch_function r/w 0x0 3 0x2c ch b _adc_samp_n um r/w 0x02 0x02 cht_e xpotime r/w 0x28 0x2d chc_adc_samp_n um r/w 0x02 0x03 cht_leddac r/w 0x50 0x2e adc_ n ormalized _enl r/w 0x00 0x04 touch_upperth_lb r/w 0x00 0x2f wr_data_trun cate r/w 0x0a 0x05 touch_upperth_hb r/w 0x07 0x30 tg_enable r/w 0x00 0x0 7 t ouch _lower th_lb r/w 0x00 0x35 int _type r/w 0x3e 0x0 8 t ouch _lower th_hb r/w 0x06 0x36 int_ mode_sel r/w 0x0e 0x0a touch _count_th r/w 0x01 0x37 int_mask_select r/w 0x00 0x0b notouch _count_th r/w 0x00 0x38 cha_auto_frame period_enh r/w 0x0 1 0x0d c h t_led _assign r/w 0x01 0x3c cha_auto_fp_max_lb r/w 0x8 0 0x0e cht_ pixel_assign r/w 0x10 0x3d cha_auto_fp_max_hb r/w 0 x 02 0x11 cht_frame_ period r/w 0x0a 0x3 e cha_auto_fp_min _lb r/w 0x14 0x12 cht_report_d ivider_lb r/w 0x14 0x3 f cha_auto_fp_min _hb r/w 0 x00 0x13 cht_report_d ivider_hb r/w 0x00 0x40 ch b _auto_frame period_enh r/w 0x0 1 0x14 cht_adc_samp_n um r/w 0x03 0x44 chb _auto_fp_max_lb r/w 0 x8 0 0x15 ch a _frame_ period_lb r/w 0x28 0x45 chb_auto_fp_max_hb r/w 0 x02 0x16 ch a _frame_ period_hb r/w 0x00 0x46 ch b _auto_fp_min _lb r/w 0x 14 0x17 ch b _frame_ period_lb r/w 0x28 0x47 chb_auto_fp_min _hb r/w 0 x00 0x18 ch b _frame_ period_hb r/w 0x00 0x48 ch c _auto_frame period_enh r/w 0x01 0x19 ch c _frame_ period_lb r/w 0x28 0x4c chc_auto_fp_max_lb r/w 0x8 0 0x1a ch c _frame_ period_hb r/w 0x00 0x4d chc_auto_fp_max_hb r/w 0 x02 0x1b ch a _ frame_ samp_num r/w 0x04 0x4e chc_auto_fp_min _lb r/w 0x14 0x 1 c ch b _ frame_ samp_num r/w 0x04 0x4f chc_auto_fp_min _hb r/w 0 x00 0x1d ch c _ frame_ samp_num r/w 0x04 0x56 fifo_rptnum_lb r/w 0x29 0x21 cha_ function r/w 0x 6 8 0x57 fifo_rptnum_hb r/w 0x00 0x2 3 chb_ function r/w 0x 6 9 0x58 fifo_autoclearnum r/w 0x14 0x2 4 u pdat e_flag r/w 0x00 0x5a fifo_data_mode r/w 0x03 0x2 5 chc_ function r/w 0x 6 9 0x5b fifo _ info _mode r/w 0x00 0x26 golden_report_di vider_lb r/w 0x40 0x5d led 0 dac_ man_code r/w 0x40 0x27 golden_report_di vider_hb r/w 0x06 0x5e led 1 dac_ man_code r/w 0x40 0x28 c h a _report_d ivider r/w 0x01 0x5f led 2 dac_ man_code r/w 0x40 0x29 chb_report_d ivider r/w 0x01 0x60 leddac_test_enh r/w 0 x00 0x2a chc_report_d ivider r/w 0x01 0x2b cha_adc_samp_n um r/w 0x02
24 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. table 10 . register bank2 note : switch to register ba nk2 by writing 0x02 to reg - 0x7f address register name access default address register name access default 0x00 read_touch_data_lb ro 0x00 0x16 read_cha_adc_data _hb ro 0x00 0x01 read_touch_data_hb ro 0x00 0x17 read_ch b _adc_data _lb r o 0x00 0x 0 3 read_cha_e t_lb ro 0x00 0x18 read_chb_adc_data _hb ro 0x00 0x04 read_cha_e t_hb ro 0x00 0x19 read_chc_adc_data _lb ro 0x00 0x06 read_chb_e t_lb ro 0x00 0x1a read_chc_adc_data _hb ro 0x00 0x07 read_chb_e t_hb ro 0x00 0x1b int_reg_array r/w 0x00 0x 09 read_ch c _e t_lb ro 0x00 0x1c read_fifo_checksum_a ro 0x00 0x0a read_chc_e t_hb ro 0x00 0x1d read_fifo_checksum_b ro 0x00 0x0c read_cha_leddac ro 0x00 0x1 e read_fifo_checksum_c ro 0x00 0x0d read_ch b _leddac ro 0x00 0x1f read_fifo_checksum_d ro 0x00 0x0e read_chc_leddac ro 0x00 0x20 read_fifo_checksum_e ro 0x00 0x0f read_cha_fp_lb ro 0x00 0x25 fifo_rptnum_sync _lb ro 0x00 0x10 read_cha_fp_hb ro 0x00 0x26 fifo_rptnum_sync _hb ro 0x00 0x11 read_chb_fp_lb ro 0x00 0x4b timestamp_enh r/w 0x00 0x12 read_chb_f p_hb ro 0x00 0x4e timestamp_data_a ro 0x00 0x13 read_ch c _fp_lb ro 0x00 0x4f timestamp_data_ b ro 0x00 0x14 read_chc_fp_hb ro 0x00 0x50 timestamp_data_ c ro 0x00 0x15 read_cha_adc_data _lb ro 0x00 register bank 3 are fifo data, use interface to burst re ad address 0x00 for acquiring fifo data. note: switch to register ba nk 3 by writing 0x0 3 to reg - 0x7f table 11 . register bank 4 note: switch to register ba nk 4 by writing 0x0 4 to reg - 0x7f address register name access default 0x15 int_direction r/w 0x0f 0x64 global_reset_n r/w 0x01 0x65 tg_reset_n r/w 0x01 0x66 reg_reset_ n r/w 0x01 0x69 pd _mode_enh r/w 0x00
25 pixart imagi ng inc. pah8011es product datasheet low power heart rate monitor optical chip version 1. 1 | 20 oct 2017 | 31008 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. document revision history r evision number date description 1.0 09 may 201 7 product release version . update from previous version v0.91 1. add maximum load current of ldo in section 4.4.1 schematic design 2. update figure 4 . package marking 1.1 20 oct. 2017 1. remove pcb layout guidelines item(5) 2. modify debug mode as i nfo. mode m odify recommended layout pcb


▲Up To Search▲   

 
Price & Availability of PAH8011ES-IN

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X